Thermal Interface Materials

Electronic devices and systems continue to be designed to run at increasingly higher clock speeds while at the same time being reduced in size. As a result Thermal Management becomes more important to the functionality of a product. To increase heat dissipation between a hot area and the cooling device such as a heat sink, THERMAWORX Thermal Interface Materials are used. These silicone based materials work by displacing the air in uneven areas with highly conductive material yielding increased cooling. Thermal Interface Materials offer excellent thermal transfer properties across a wide gap range, and are available in several formulations for use in a variety of thermal management scenarios.



Material Type   T100 T150  T200  T250 T300 T350 T400 T500 T600 T700 T1500
Base Elastomer   Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone Silicone
Reinforcement   Fiberglass Fiberglass Fiberglass Fiberglass Fiberglass NA NA NA NA NA NA
Color   L. Gray Pink L. Blue Yellow D. Blue Green L. Red White Gray Gray Black
Thickness Range (mm)   0.5 - 14 0.5 - 14 0.3 - 14 0.3 - 14 0.3 - 14 0.5 - 5.0 0.5 - 5.0 0.5 - 3.0 0.5 - 3.0 0.5 - 3 0.5-2
Thermal/ Electrical Test Method T100 T150 T200 T250 T300 T350 T400 T500 T600 T700 T1500
Thermal Conductivity (W/m*K) ASTM D5470 1.0 1.5 2.0 2.5 3.0 3.5 4.0 5.0 6.0 7.0 15.0
Thermal Impedance ASTM D5470 1.5 1.5 1.0 1.0 0.75 0.75 0.50 0.45 0.40 .30 .15
Dielectric Strength ASTM D149 7 7 8 8 8 8 9 9 9 2 .5
Dielectric Constant @ 1 MHz ASTM D150 6.8 7.2 7.2 6.3 6.3 5.2 7.0 5.0 4.1 5.0 15.0
Volume Resistivity ohms-cm ASTM D257 1014 1014 1014 1014 1014 1014 1014 1014 1014 1011 1014
Physical Properties Test Method T100 T150 T200 T250 T300 T350 T400 T500 T600 T700 T1500
Hardness, Shore OO ASTM D2240 12 15 18 25 30 35 40 45 50 65 45
Specific Gravity (g/cm3 ASTM D792 2.32 2.62 2.80 2.95 3.20 3.05 3.10 3.10 2.30 3.20 1.50
Tensile Strength ASTM D412 0.55 0.52 0.43 0.32 0.30 0.28 0.25 0.15 0.36 0.10 0.12
Elongation %  ASTM D412 56.4 97.3 104.5 125.4 86.5 58.8 84.7 60 32.4 45.0 200.0
Temperature Range (°C) -50°C to 160°C
Outgassing, %TML ASTM E595 <0.4 <0.4 <0.35 <0.35 <0.3 <0.2 <0.2 <0.5 <0.6 <0.7 <0.5
Flame Rating UL94 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 V-0 v-0  
Shelf Life Months 24 24 24 24 24 24 24 24 24    


  • Available as Sheet Stock
  • Can be Die Cut to any size
  • Kiss-Cutting available
  • Can be custom molded
  • Available with adhesive backing


  • Soft, Excellent Compression Rate
  • Large Gap Range
  • UL94 V-O Flammability Rated
  • RoHS & REACH Compliant
  • Material Specific Thermal Conductivity


  • Power Conversion
  • Flat Panel Displays
  • LED Lighting
  • Audio - Video Devices
  • Instrumentation

Welcome to 3G Shielding's Thermal Catalog, where we present our range of advanced thermal management solutions. In this section, we focus on the revolutionary Thermal Gap Pads, an essential component in efficiently transferring heat away from critical electronic devices. These high-performance thermal gap pads are designed to bridge the gaps between heat-generating components and heat sinks, ensuring optimal heat dissipation and prolonged device reliability.

What are Thermal Gap Pads?

Thermal gap pads are soft, compressible thermal interface materials (TIMs) designed to fill gaps and irregularities between electronic components and heat sinks. They provide efficient heat conduction by eliminating air gaps, thereby facilitating the transfer of heat away from the source to the sink. Thermal gap pads come in various formulations, thicknesses, and thermal conductivities, making them suitable for a wide range of applications.

Key Benefits of 3G Shielding's Thermal Gap Pads:

  • Superior Thermal Conductivity: Our thermal gap pads boast high thermal conductivity, allowing for effective heat dissipation. With low thermal resistance, they minimize the risk of overheating and ensure optimum performance of your electronic devices.
  • Even and Uniform Thermal Interface: The soft and conformable nature of our gap pads ensures complete contact with irregular surfaces, creating an even and uniform thermal interface. This minimizes the presence of air gaps, a common issue with rigid TIMs, and enhances the overall thermal performance.
  • Electrical Insulation: To prevent electrical short circuits and EMI (Electromagnetic Interference), our thermal gap pads offer excellent electrical insulation properties. This ensures safe and reliable operation, especially in high-voltage applications.
  • Reliable Performance Across Temperature Range: Our thermal gap pads are engineered to maintain their properties across a wide temperature range, making them suitable for extreme operating conditions and rugged environments.
  • Easy Application and Reusability: 3G Shielding's thermal gap pads are user-friendly and easy to install, saving valuable time during assembly. Additionally, they can be repositioned or reused without compromising their performance, reducing material wastage and costs.


Our thermal gap pads find applications in various industries, including:

  • Electronics: CPUs, GPUs, power modules, LED lighting, and other semiconductor devices.
  • Automotive: Battery packs, electric vehicle power electronics, infotainment systems.
  • Telecom: Base stations, routers, servers, and communication equipment.
  • Aerospace: Avionics, satellite systems, and radar equipment.

When it comes to advanced thermal management, 3G Shielding's Thermal Gap Pads are the ideal solution to efficiently dissipate heat and improve the performance and reliability of electronic systems. With their superior thermal conductivity, ease of application, and excellent electrical insulation, our thermal gap pads are a crucial addition to any thermal management project. Choose 3G Shielding to elevate your thermal solutions and achieve optimum device performance.