SMT Grounding Pad
Since 1994, 3G has been providing shielding solutions for the most demanding applications. From simple Flex shields that have the best shielding effectiveness in the industry to 100 cavity plus Multizone shields or Hybrid shields that work at 5G frequencies, 3G has always innovated new techniques for shielding.
3G is now pleased to offer SMT Grounding Pads. SMT Grounding Pads are commonly used as a grounding contact on PCBs throughtout the electronics industry. Providing reliable grounding and shielding performance in challenging conditions the pads are delivered in tape-and-reel packaging for automated placement with standard SMT equipment. Comprised of a Ni-C loaded conductive silicone gasket these pads are laminated with a solderable metal strip for easy reflow.
3G SMT Grounding Pads provide superior EMI protection and easy SMT integration. 3G SMT Grounding pads are comprised of a Nickel Graphite filled silicone elastomer laminated to a Tin-Plated Steel shim using conductive adhesive. The pads are packaged in tape and reel for automated installation and are soldered directly to traces on boards using reflow soldering technology.
The SMT Grounding Pads are engineered to provide unsurpassed conductivity in a wide range of compressed heights with the convenience of SMT compatible format and are ideal for grounding housings, shields, LCDs and antenna contacts. 3G offers two lines of SMT Grounding Pads.
3G SMT Pads are available in a variety of sizes in four different heights.
In addition 3G Soft SMT Grounding Pads are available to ground gaps as large as 2.20mm.
To ensure repeatable compression 3G recommends the use of mechanical compression stops allowing compression of 20-25% of the Grounding Pad’s thickness. The recommended operating temperature is -55°C to 125°C. 3G SMT Grounding Pads are RoHS and REACH compliant.
3G SMT Grounding pads have a Shore A hardness of 40 durometers and offer a Volume Resistivity of 0.100 Ohm-cm while exhibiting Shielding Effectiveness of -100 dB at 20 MHz – 10 GHz.